• KAPPA 2000
  • KAPPA 2000

KAPPA 2000

Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts.
Applications including : automotive electronics, PCBA,coil, fiber-optic, LED lighting, wire, cable, etc.

Operating temperatureAmbient up to 250°C
Melting TankMT-05-2000 x 1 (Option x 2)
Clamping force1.2T
Electrical connection200~240VAC / 1 Phase / 50 or 60Hz
Power input4.5 kW
Min air pressure0.5 MPa / 73Psi
Footprint1300mm x 950mm
Mould set size230mm x 120mm x 150mm/25kg
Max Mould Set Size300mm x 200mm x 150mm