KAPPA 2000
Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts.
Applications including : automotive electronics, PCBA，coil, fiber-optic, LED lighting, wire, cable, etc.
| Operating temperature | Ambient up to 250°C |
| Melting Tank | MT-05-2000 x 1 (Option x 2) |
| Clamping force | 1.2T |
| Electrical connection | 200~240VAC / 1 Phase / 50 or 60Hz |
| Power input | 4.5 kW |
| Min air pressure | 0.5 MPa / 73Psi |
| Footprint | 1300mm x 950mm |
| Mould set size | 230mm x 120mm x 150mm/25kg |
| Max Mould Set Size | 300mm x 200mm x 150mm |
