A Green Alternative
low pressure moulding is an innovative process designed to protect your electronics from environmental factors such as moisture, dust, vibration and handling
When you replace traditional electronics potting with the low pressure moulding Process you are replacing up to 8 steps with 3 simple steps.
Insert parts directly into the mould set.
30 sec – 2 min encapsulation process.
Parts handled immediately after moulding.
Low Pressure Moulded products extend across a variety of applications catering for a diverse array of industry sectors.